Quality Standards, Flexibility & Traceability

ISO 9001:2015

ISO 9001:2015

Certified QMS*

IPC-A-610

IPC-A-610

Class 2/3 Criteria

RoHS / REACH

RoHS / REACH

Compliance Support

Free DFM

Free DFM

Review Support

Flexible MOQ

Flexible MOQ

Prototype to Production

Traceable

Traceable

Components & Production

8+

8+

SMT Lines

30+

30+

Countries Served

PCB Assembly Support from Prototype to Production

We provide PCB assembly services covering SMT assembly, through-hole assembly, mixed technology assembly, inspection, testing, and production preparation for PCBA projects.

  • SMT Assembly
  • Through-Hole Assembly
  • Mixed PCB Assembly
  • One-Stop PCBA Support
PCB Assembly
SMT Automated placement
THT Manual insertion
Mixed Process assembly

Surface Mount Assembly for High-Density PCBAs

SMT assembly supports compact and high-density PCB designs with automated placement, reflow soldering, and process inspection.

  • SMT Placement Capability
  • Minimum Component Size, such as 0201 / 01005
  • BGA / QFN Support
  • Reflow Soldering
  • AOI / SPI Inspection
PCB Assembly

Through-Hole Assembly for Connectors and High-Stress Components

Through-hole assembly supports components that require stronger mechanical connection, higher current handling, or manual insertion.

  • DIP Assembly
  • Wave Soldering
  • Manual Soldering
  • High-Power Components
  • Connectors
PCB Assembly

Mixed Technology Assembly for Complex PCB Designs

Mixed PCB assembly combines SMT and through-hole processes for boards with different component types, soldering requirements, and production needs.

  • SMT + THT Mixed Assembly
  • Complex PCB Assembly
  • Multi-Process Assembly
PCB Assembly

PCB Assembly Capabilities

Our assembly capabilities support different PCB structures, component packages, board sizes, production volumes, and process requirements.

PCB Layer Count

PCB Layer Count

Assembly support for common single-sided, double-sided, and multilayer PCB projects.

Minimum Component Size

Minimum Component Size

Supports small surface-mount components such as 0201 / 01005 based on project needs.

Minimum Pitch

Minimum Pitch

Fine-pitch package assembly support for compact and high-density PCBAs.

Board Size Range

Board Size Range

Prototype, pilot run, and batch PCBA projects with different board dimensions.

Production Capacity

Production Capacity

Flexible support for prototype, pilot run, small-batch, and production quantities.

Process Capabilities

Process Capabilities

SMT, THT, mixed assembly, inspection, testing, and production preparation.

Industries We Support

Industrial Control

Industrial Control

Control boards and electronics for automation equipment, sensors, controllers, and industrial monitoring systems.

Read More
Features
  • Automation control systems
  • Sensor and controller boards
  • Industrial monitoring devices

Send Your PCB Assembly Files for Review

Share your Gerber files, BOM, Pick & Place files, assembly drawings, testing requirements, or available project information. Our team will review your assembly requirements before production.

  1. Gerber Files
  2. BOM
  3. Pick & Place Files
  4. Assembly Drawings
  5. Testing Requirements
  6. Project Information
  7. Prototype Quantity
  8. Production Schedule
PCB Assembly

Discuss Your PCB Assembly Project

Share your available files, quantities, testing needs, and delivery requirements for engineering review.

Start Your PCB Assembly Project

We review the affected component, footprint, polarity, soldering condition, and production files before continuing. Any change that requires your confirmation will be discussed with you before production moves forward.

How are BGA, QFN, and small components inspected?

SPI and AOI can be used to check solder paste and component placement, while X-ray inspection can be arranged for hidden solder joints such as BGA and QFN packages. The inspection method is confirmed according to the board design.

Yes. We can support prototypes, engineering samples, pilot runs, and repeat production. Confirmed production files, assembly instructions, and inspection requirements can be carried forward to later batches.

Yes. We support SMT, through-hole, and mixed assembly. The production process is confirmed according to the component types, board design, soldering requirements, and order quantity.

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