Inspection and Testing for Reliable PCBA Delivery

We provide PCBA inspection, testing, and quality control throughout the production process, helping verify soldering quality, component placement, electrical performance, functional operation, and final product readiness before delivery.

  • AOI Inspection
  • X-ray Inspection
  • ICT Testing
  • FCT Testing
  • Quality Reports
PCBA Testing
AOI / X-ray Inspection
ICT / FCT Verification
Reports Documentation

PCBA Inspection and Testing Methods

Different inspection and testing methods can be applied according to board complexity, component type, soldering requirements, product function, and customer specifications.

AOI Inspection

AOI Inspection

Checks component placement, polarity, solder joints, missing parts, offset, and visible assembly defects.

X-ray Inspection

X-ray Inspection

Supports inspection of hidden solder joints such as BGA, QFN, and other bottom-terminated components.

ICT Testing

ICT Testing

Verifies circuit connectivity, component values, open circuits, short circuits, and basic electrical conditions.

FCT Testing

FCT Testing

Tests the functional performance of the assembled PCBA according to product requirements and customer-defined test procedures.

Quality Control Across Production Stages

Quality control is applied from incoming materials to in-process inspection and final verification, helping reduce assembly defects and improve production consistency.

IQC

Incoming Quality Control

Incoming Quality Control for components, PCB boards, materials, labels, packaging, and basic quality requirements before production.

IPQC

In-Process Quality Control

In-Process Quality Control during SMT assembly, through-hole assembly, soldering, inspection, and testing.

FQC

Final Quality Control

Final Quality Control before shipment, including appearance inspection, testing confirmation, documentation review, and delivery preparation.

From Incoming Inspection to Final Delivery

We follow a controlled inspection process to check materials, monitor assembly, perform testing, and confirm quality before shipment.

PCB Assembly Testing Requirements Review

We can review your test requirements, functional specifications, firmware programming needs, test fixture requirements, and pass/fail criteria before production.

  • Functional specifications
  • Firmware programming needs
  • Test fixture requirements
  • Pass / fail criteria
  • Customer-defined test procedures
  • Product samples or reference units
  • Special inspection requirements
Functional Test Preparation and Verification

Test Reports and Quality Documentation

Testing and quality reports can be provided according to project requirements, helping customers review production results and quality status before delivery.

AOI inspection records

AOI inspection records

X-ray inspection records

X-ray inspection records

ICT test results

ICT test results

FCT test results

FCT test results

Final inspection records

Final inspection records

Quality reports

Quality reports

Send Your PCBA Testing Requirements

Share your Gerber files, BOM, test requirements, functional specifications, firmware needs, product samples, or available project information. Our team will review the required inspection and testing methods before production.

  1. Gerber Files
  2. BOM
  3. Test Requirements
  4. Functional Specifications
  5. Firmware Programming Needs
  6. Test Fixture Requirements
  7. Product Samples
  8. Pass / Fail Criteria
  9. Quality Report Requirements
PCBA Testing

Discuss Your PCB Assembly Project

Share your available files, quantities, testing needs, and delivery requirements for engineering review.

Start Your PCB Assembly Project

We review the board complexity, component packages, test access, product function, and quality requirements before confirming the test plan. Depending on the project, AOI, X-ray, ICT, FCT, or other specific tests can be combined as needed.

Can you inspect hidden solder joints?

Yes. X-ray inspection can be used for BGA, QFN, and other packages with solder joints hidden beneath the component. AOI can be used alongside X-ray to check visible placement, polarity, and soldering conditions.

Yes. Functional testing can follow your test procedures, firmware requirements, fixtures, reference samples, and pass/fail criteria. We review the available information with you before production and confirm a practical testing method for the project.

Depending on the agreed project requirements, available records may include AOI inspection records, X-ray images, ICT or FCT results, final inspection records, and quality reports. The required documentation is confirmed before production.

This site uses cookies

We use cookies to collect information about how you use this site. We use this information to make the website work as well as possible and improve our services.more details