AOI Inspection
Checks component placement, polarity, solder joints, missing parts, offset, and visible assembly defects.
We provide PCBA inspection, testing, and quality control throughout the production process, helping verify soldering quality, component placement, electrical performance, functional operation, and final product readiness before delivery.
Different inspection and testing methods can be applied according to board complexity, component type, soldering requirements, product function, and customer specifications.
Checks component placement, polarity, solder joints, missing parts, offset, and visible assembly defects.
Supports inspection of hidden solder joints such as BGA, QFN, and other bottom-terminated components.
Verifies circuit connectivity, component values, open circuits, short circuits, and basic electrical conditions.
Tests the functional performance of the assembled PCBA according to product requirements and customer-defined test procedures.
Quality control is applied from incoming materials to in-process inspection and final verification, helping reduce assembly defects and improve production consistency.
Incoming Quality Control for components, PCB boards, materials, labels, packaging, and basic quality requirements before production.
In-Process Quality Control during SMT assembly, through-hole assembly, soldering, inspection, and testing.
Final Quality Control before shipment, including appearance inspection, testing confirmation, documentation review, and delivery preparation.
We follow a controlled inspection process to check materials, monitor assembly, perform testing, and confirm quality before shipment.
We can review your test requirements, functional specifications, firmware programming needs, test fixture requirements, and pass/fail criteria before production.
Testing and quality reports can be provided according to project requirements, helping customers review production results and quality status before delivery.
Share your Gerber files, BOM, test requirements, functional specifications, firmware needs, product samples, or available project information. Our team will review the required inspection and testing methods before production.
Share your available files, quantities, testing needs, and delivery requirements for engineering review.
We review the board complexity, component packages, test access, product function, and quality requirements before confirming the test plan. Depending on the project, AOI, X-ray, ICT, FCT, or other specific tests can be combined as needed.
Yes. X-ray inspection can be used for BGA, QFN, and other packages with solder joints hidden beneath the component. AOI can be used alongside X-ray to check visible placement, polarity, and soldering conditions.
Yes. Functional testing can follow your test procedures, firmware requirements, fixtures, reference samples, and pass/fail criteria. We review the available information with you before production and confirm a practical testing method for the project.
Depending on the agreed project requirements, available records may include AOI inspection records, X-ray images, ICT or FCT results, final inspection records, and quality reports. The required documentation is confirmed before production.
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